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95% Copper Coated DBC Direct Bonded Copper Substrate Ceramic Substrate With Gold-Plated

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95% Copper Coated DBC Direct Bonded Copper Substrate Ceramic Substrate With Gold-Plated

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Brand Name : MH

Model Number : MH01

Certification : RoHS ISO9001

Place of Origin : CHINA

MOQ : 500 PCS

Price : USD 0.1-3PCS

Payment Terms : L/C, T/T, Western Union

Supply Ability : 5000 PCS WEEK

Delivery Time : 15-20DAYS

Packaging Details : CARTON/WOODEN BOX

Material : 95% alumina ceramic

Color : White

Density : 3.6 g/cm³

Hardness : 10.7 Gpa

Size : Customers' Requests

Flexural strength : 300 Mpa

Thermal conductivity : 25 w/(m.k)

Insulation breakdown Intensity : 18 KT/mm

OEM,ODM : Accept

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Copper coated DBC ceramics substrate with Gold-plated

Direct bonded copper (DBC) substrates are commonly used in power modules, because of their very good thermal conductivity. They are composed of a ceramic tile (commonly alumina) with a sheet of copper bonded to one or both sides by a high-temperature oxidation process (the copper and substrate are heated to a carefully controlled temperature in an atmosphere of nitrogen containing about 30 ppm of oxygen; under these conditions, a copper-oxygen eutectic forms which bonds successfully both to copper and the oxides used as substrates). The top copper layer can be preformed prior to firing or chemically etched using printed circuit board technology to form an electrical circuit, while the bottom copper layer is usually kept plain. The substrate is attached to a heat spreader by soldering the bottom copper layer to it.
1. Thickness of substrate can be thin: 0.25mm,0.28mm,0.45mm,0.5mm,0.635mm,1.0mm,1.5mm, 1.8mm,2.0mm
2. Coating by Cu ,Mo/Mn,Ag, Plate with copper
3. Excellent thermal conductivity
4. High electrical insulation

Properties Unit Steatite ceramic 95% Al2O3 99% Al2O3 Zirconia Ceramic
Density g/cm³ 2.8 3.6 3.8 5.6
Flexural strength Mpa 145 300 300 354
Max Working Temperature ℃ 1100 1400 1600 1400
Sintering temperature ℃ 1350 1700 1750 1550
Heat resistance T(℃) 200 220 200 350
Hardness Gpa 5.7 7 10.7 12.3
Elastic modulus Gpa 120 275 320 205
Poissons ratio - 0.21 0.22 0.22 0.30
Linear expansion coefficient x 10-6/℃ 7.9 7.1 7.8 9
Insulation breakdown Intensity KT/mm 10 16 18 15
Thermal conductivity w/(m.k) 2.5 20 25 2.5
Specific Heat *10-3J/(kg*K) 0.75 0.78 0.78 0.4

95% Copper Coated DBC Direct Bonded Copper Substrate Ceramic Substrate With Gold-Plated95% Copper Coated DBC Direct Bonded Copper Substrate Ceramic Substrate With Gold-Plated95% Copper Coated DBC Direct Bonded Copper Substrate Ceramic Substrate With Gold-Plated

95% Copper Coated DBC Direct Bonded Copper Substrate Ceramic Substrate With Gold-Plated95% Copper Coated DBC Direct Bonded Copper Substrate Ceramic Substrate With Gold-Plated

95% Copper Coated DBC Direct Bonded Copper Substrate Ceramic Substrate With Gold-Plated


Product Tags:

95% direct bonded copper substrate

      

ROHS direct bonded copper substrate

      

ceramic substrate 300Mpa

      
China 95% Copper Coated DBC Direct Bonded Copper Substrate Ceramic Substrate With Gold-Plated factory

95% Copper Coated DBC Direct Bonded Copper Substrate Ceramic Substrate With Gold-Plated Images

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