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Brand Name : MH
Model Number : MH01
Certification : ISO9001 ROHS
Place of Origin : CHINA
MOQ : 100 pcs
Price : USD 0.5-1/PCS
Payment Terms : L/C, T/T, Western Union
Supply Ability : 5000 PCS WEEK
Delivery Time : 15-20DAYS
Packaging Details : Export carton
Material : 95% alumina ceramic
Color : White
Density : 3.6g/cm³
Working Temperature : 1500℃
OEM,ODM : Acceptable
MOQ : 500 pcs
Package : Carton
Size : customized
95% Alumina Ceramic Plate Heat Resistant Ceramic substrate
Alumina ceramic substrate is widely used in many fields. Because of its great performance, it is more and more used in curent society, alumina ceramic substrate can meet the requirement of daily using and specifical features.
95% Alumina Ceramic is commonly used in the electronics industry like thick film circuits, large-scale integrated circuits, hybrid ICs, semiconductor packages, chip resistors, network resistors, focus potentiometers, etc., it is most frequently used ceramic substrates because of its excellent advantages.
Features
Main Features OF ALUMINA CERAMIC SUBSTRATE
1. material: Alumina ceramic
2. method of moulding: thermal casting/drying press/extrusion
3. colour: white/light yellow
4. sintering temperature: 1580℃
5. surface finish:Ra0.4 &SIM RA 0.8&mum etc, upon your requirement.
6. package: packing with carton and ship with wooden box.
7. we can produce them by your molds or te drawings you require.
8. minimum order: 100pcs
✔High mechanical strength and hardness
✔Good electrical insulation
✔Low dielectric constant and dielectric loss
✔Similar thermal expansion with Si
✔High thermal conductivity
✔Excellent corrosion resistance
✔Non-toxic
✔Available for surface metalization
Properties | Unit | Steatite ceramic | 95% Al2O3 | 99% Al2O3 | Zirconia Ceramic |
Density | g/cm³ | 2.8 | 3.6 | 3.8 | 5.6 |
Flexural strength | Mpa | 145 | 300 | 300 | 354 |
Max Working Temperature | ℃ | 1100 | 1400 | 1600 | 1400 |
Sintering temperature | ℃ | 1350 | 1700 | 1750 | 1550 |
Heat resistance | T(℃) | 200 | 220 | 200 | 350 |
Hardness | Gpa | 5.7 | 7 | 10.7 | 12.3 |
Elastic modulus | Gpa | 120 | 275 | 320 | 205 |
Poissons ratio | - | 0.21 | 0.22 | 0.22 | 0.30 |
Linear expansion coefficient | x 10-6/℃ | 7.9 | 7.1 | 7.8 | 9 |
Insulation breakdown Intensity | KT/mm | 10 | 16 | 18 | 15 |
Thermal conductivity | w/(m.k) | 2.5 | 20 | 25 | 2.5 |
Specific Heat | *10-3J/(kg*K) | 0.75 | 0.78 | 0.78 | 0.4 |
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95% Alumina Ceramic Plate 3.6g/Cm3 Heat Resistant Ceramic Substrate Images |